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| www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 1/22 31.aug.2012 rev.001 tsz22111 ? 14 ? 001 datasheet figure.1 typical application circuit 2.55v/0.4a 1.8v/0.3a output 2ch synchronous buck converter integrated fet BD91501MUV description rohms buck converter BD91501MUV is a 2ch output power supply designed to produce a low voltage including 2.55v/0.4a and 1. 8v/0.3a from 3.3v power supply line. offers high efficiency with our original pulse skip control technology and synchronous rectifier. employs a current mode control system to provide faster transient response to sudden change in load. features ? offers fast transient response with current mode pwm control system. ? offers highly efficiency for all load range with synchronous rectifier (pch/nch fet) and sllm tm (simple light load mode) ? incorporates soft start function ? incorporates thermal prot ection and uvlo function ? incorporates short-current protection with timer latch ? incorporates shutdown function icc=0a (typ.) ? full 100% duty function ? 2ch output power supply (2.55v, 1.8v) ? 2ch output on/off individual control ? employs small surface mount package: vqfn016v3030 usage power supply for lsi including dsp, ddr(ram), micro computer and asic key specifications ? input voltage range: 2.55v to 5.5v ? output volatage: 1.8v,2.55v ? output voltage accuracy 1.5% ? switching frequency: 1.65mhz 20% ? low voltage detection: 50%(typ.) ? maximum on duty: 100% ? operating temperature range: -30 to +105 package (typ.) (typ.) (max.) vqfn016v3030: 3.00mm 3.00 1.00mm typical application circuit product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. vqfn016v3030 nl nl downloaded from: http:///
www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 2/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet pin configureuration(top view) figure.2 pin configureuration pin description pin no. pin name pin function pin no. pin name pin function 1 pgnd2 ch2 low side source pin 9 avcc analog vcc pin 2 pvcc2 ch2 high side source pin 10 n.c. non connection (pleas e connect to agnd) 3 pvcc1 ch1 high side source pin 11 n.c. non connection (pleas e connect to agnd) 4 pgnd1 ch1 low side source pin 12 agnd analog gnd pin 5 sw1 ch1 pch/nch fet drain output pin 13 ith2 ch2 gm amplifier output pin /connected phase compensation capacitor 6 en1 ch1 enable pin (high active) 14 fb2 ch2 output voltage detect pin 7 fb1 ch1 output voltage detect pin 15 en2 ch2 enable pin (high active) 8 ith1 ch1 gm amplifier output pin /connected phase compensation capacitor 16 sw2 ch2 pch/nch fet drain output pin block diagram figure.3 block diagram 12 11 10 9 4 3 2 1 8 6 5 7 13 15 16 14 sw1 en1 agnd n.c. n.c. avcc fb1 ith1 fb2 en2 sw2 ith2 pgnd2 pvcc2 pvcc1 pgnd1 gm amp gm amp agnd downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 3/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet absolute maximum ratings (ta=25 ) parameter symbol rating unit power supply voltage v cc -0.3 to +7 * 1 v en voltage v en 1 -0.3 to +7 v v en 2 -0.3 to +7 v sw voltage vsw1 -0.3 to +7 v vsw2 -0.3 to +7 v power dissipation pd1 0.27 * 2 w pd2 0.62 * 3 w pd3 1.77 * 4 w pd4 2.66 * 5 w operating temperature r ange topr -30 to +105 storage temperature range tstg -55 to +150 maximum junction temperature tj +150 * 1 pd, aso and tj=150 should not be exceeded. *2 ic only *3 1-layer. mounted on a 74.2mm 74.2mm 1.6mm glass-epoxy pcb,( copper foil area:surface 6.28mm 2 *4 4-layer. mounted on a 74.2mm 74.2mm 1.6mm glass-epoxy pcb,( copper foil area:surface and bottom layer 6.28mm 2 ,2 nd and 3 rd layer 5505mm 2) *5 4-layer. mounted on a 74.2mm 74.2mm 1.6mm glass-epoxy pcb,(copper foil area:all layers 5505mm 2 ) recommended operating ratings (ta=-30 to +105 ) parameter symbol limits unit min. typ. max. power supply voltage av cc 2.55 3.3 5.5 v pvcc 2.55 3.3 5.5 v en voltage v en 1 0 - av cc v v en 2 0 - av cc v sw average output current i sw 1 - - 400* 6 ma i sw 2 - - 300* 6 ma * 6 pd and aso should not be exceeded. electrical characteristics ( ta = 2 5 av cc =pv cc =3.3v, en1=en2=av cc , unless otherwise specified. ) parameter symbol limits unit conditions min. typ. max. standby current i stb - 0 10 a en1=en2=0v bias current i cc - 500 800 a en low voltage v enl - gnd 0.8 v in stand-by mode en high voltage v enh 2.0 vcc - v in active mode en input current i en - 1 10 a ven1=ven2=2v oscillation frequency f osc 1.32 1.65 1.98 mhz pch fet on resistor r onp 1 - 0.85 1.56 v cc =3.3v r onp 2 - 0.85 1.56 v cc =3.3v nch fet on resistor r onn 1 - 0.65 1.3 v cc =3.3v r onn 2 - 0.65 1.3 v cc =3.3v output voltage fb1 2.512 2.55 2.588 v 1.5% fb2 1.773 1.8 1.827 v 1.5% uvlo threshold voltage v uvlo1 2.20 2.30 2.40 v v cc =5v 0v uvlo release voltage v uvlo2 2.22 2.35 2.50 v v cc =0v 5v soft start time t ss 0.45 0.9 1.8 ms timer latch time t latch 0.62 1.24 2.48 ms scp/tsd on output short circuit threshold voltage v scp 1 - 1.275 1.77 v fb1=2.55 0v v scp 2 - 0.9 1.26 v fb2=1.8 0v downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 4/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet characteristics data reference data ta = 2 5 ,vcc=3.3v,ven=3.3v,unless otherwise specified figure.4 vcc-vout figure.5 ven-vout figure.6 iout-vout 0 0.5 1 1.5 2 2.5 3 3.5 0 200 400 600 800 1000 io[ma] output voltage[v] 2.3 2.35 2.4 2.45 2.5 2.55 2.6 - 4 0- 2 00 2 04 06 08 01 0 0 ta[ ] o u tpu t vo ltag e[v [vout1=2.55v] [vout2=1.8v setting] [vout1=2.55v] vcc=3.3v io=0a 0123 4 vcc[v] output voltage [ v ] ta = 2 5 io=0.3a [vout1=2.55v] [vout2=1.8v setting] vcc[v] 0 0.5 1 1.5 2 2.5 3 00 . 511 . 522 . 533 . 5 en[ v] output voltage [ v ] vcc=3.3v ta = 2 5 io=0a [vout1=2.55v] [vout2=1.8v setting] en[v] output voltage[v] 3 2.5 2 1.5 1 0.5 1 2 3 4 3 2.5 2 1.5 1 0.5 1 1.5 2 2.5 3 3.5 output voltage[v] 200 400 600 800 1000 i o [ma] 3.5 3 2.5 2 1 1.5 output voltage[v] figure.7 ta-vout1 2.65 2.6 2.55 2.45 2.4 2.5 output voltage[v] 0 0 0 0 0.5 0 0 0.5 -40 -20 0 20 40 60 80 100 2.35 ta [ ] downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 5/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet 0 10 20 30 40 50 60 70 80 90 100 10 100 1000 io[m a] [% ] figure.9 efficiency figure.10 ta-fosc figure.11 vcc-fosc 1.7 1.73 1.76 1.79 1.82 1.85 - 4 0- 2 00 2 04 06 08 01 0 0 ta[ ] output voltage [ v [vout2=1.8v setting] vcc=3.3v io=0a ] [z] vcc=3.3v ta = 2 5 [vout1=2.55v] [vout2=1.8v setting] vcc=3.3v ta = 2 5 figure.8 ta-vout2 -20 0 20 40 60 80 100 ta [ ] 1.74 1.77 1.8 1.83 1.86 output voltage[v] -40 1.71 -40 -20 0 20 40 60 80 100 1.3 1.5 1.6 1.8 1.9 2 1.4 1.7 ta [ ] f[mhz] 100 1000 20 40 60 80 100 10 30 50 70 90 efficiency[%] 10 0 io[ma] 4.05 3.55 4.55 5.05 1.3 1.4 1.6 1.7 1.8 2.55 1.5 vcc[v] f[mhz] 3.05 5.50 downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 6/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet figure.15 soft start waveform io=0ma 0 0.2 0.4 0.6 0.8 1 1.2 - 4 0- 2 0 0 2 04 06 08 01 0 0 ta[ ] ron[ ? ] vcc=3.3v 0 100 200 300 400 500 600 -40 -20 0 20 40 60 80 100 ta[ ] ipvccavcc[ua] vout2 [1v/div] en1=en2 [2v/div] vcc=3.3v, ta=25 time [400sec/div] vout1 [1v/div] 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 - 4 0- 2 0 0 2 04 06 08 01 0 0 ta[ ] en[v] vcc=3.3v pmos io=0.3a nmos io=0.3a vout1=2.55v vout2=1.8v 0.4 0.6 0.8 1 1.2 -40 -20 0 20 40 60 80 100 ron[ ? ] ta [ ] 0.2 0 figure.12 ta-r onn , r onp 0.4 0.6 1 1.4 1.8 20 1.6 1.20.8 0.2 en[v] figure.13 ta-v en1 , v en2 -20 0 20 40 60 80 100 ta [ ] -40 -40 -20 0 20 40 60 80 100 100 200 300 400 500 600 iccact[a] ta [ ] figure.14 ta-icc downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 7/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet figure.17 sw waveform 1 (io=0ma) figure.19 sw waveform 2 (io=0ma) figure.18 sw waveform 1 (io=0.25a) figure.16 soft start waveform io=0.3a en1=en2 [2v/div] vout2 [1v/div] vout1 [1v/div] vcc=3.3v, ta=25 time [400sec/div] time [400nsec/div] vcc=3.3v, ta=25 sw1 [2v/div] time [400nsec/div] sw1 [2v/div] time [400nsec/div] sw2 [2v/div] vout1 [50mv/div] vout1 [50mv/div] vout2 [50mv/div] vcc=3.3v, ta=25 vcc=3.3v, ta=25 vout1=2.55v vout2=1.8v downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 8/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet figure.21 vout1 transient response (io=10ma 0.25a) figure.23 vout2 transient response (io=10ma 0.25a) figure.22 vout1 transient response (io=0.25a 10ma) figure.20 sw waveform 2 (io=0.25a) vcc=3.3v, ta=25 time [400nsec/div] sw2 [2v/div] vout2 [50mv/div] time [10sec/div] vcc=3.3v, ta=25 vout1 [50mv/div] io [100ma/div] vout1 [50mv/div] io [100ma/div] time [10sec/div] time [10sec/div] vout2 [50mv/div] io [100ma/div] vcc=3.3v, ta=25 vcc=3.3v, ta=25 downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 9/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet figure.24 vout2 transient response (io=0.25a 10ma) time [10sec/div] vout2 [50mv/div] io [100ma/div] vcc=3.3v, ta=25 downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 10/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet operation BD91501MUV is a synchronous buck conver ter that achieves faster transient response by employing current mode pwm control system. it utilizes switching operation in pwm (pulse width modulation) mode for heavier load, while it utilizes sllm tm (simple light load mode) operation fo r lighter load to improve efficiency. synchronous rectifier it does not require the power to be dissipated by a rectifier ex ternally connected to a conventional dc/dc converter ic, and its p.n junction shoot-through protection circuit limits th e shoot-through current during operation, by which the power dissipation of the set is reduced. current mode pwm control synthesizes a pwm control signal with the inductor current feedback loop added to the voltage feedback. offers fast transient response with current mode control system. improves output voltage drop of load rapid change. figure.25 transient response ? pwm (pulse width modulation) control the oscillation frequency for pwm is 1.65 mhz. set signal form osc turns on a highside mos fet (while a lowside mos fet is turned off), and an inductor current i l increases. the current comparator (current comp) receives two signals, a current feedback control sign al (sense: voltage converted from i l ) and a voltage feedback control signal (fb), and issues a reset signal if both input signals are identica l to each other, and turns off the highside mos fet (while a lowside mos fet is turned on) for the rest of the fi xed period. the pwm control repeat this operation. ? sllm tm (simple light load mode) control when the control mode is shifted from pwm for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn off with the device held operated in norma l pwm control loop, which allows linear operation without voltage drop or deterioration in transient re sponse during the mode switching from light load to heavy load or vise versa. although the pwm control loop continues to operate with a set signal from osc and a reset signal from current comp, it is so designed that the reset signal is held issued if shifted to the light load mode, with which the switching is tuned off and the switching pulses are thinned out under control. ac tivating the switching intermittently reduces the switching dissipation and improves the efficiency. load response i o =10ma 250ma transient response i o =250ma 10ma vo 0.5[v/div] io 100[ma/div] vo 0.5[v/div] io 100[ma/div] fi gure. 26 effi c i ency c h aracter i st i cs o utput current i o [a] 0.001 0.01 0.1 1 0 50 100 pwm sllm improvements by sllm control effi c i ency [%] downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 11/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet ? 100% duty control maximum duty is 100% (pch mosfet is always on). if output voltage cannot keep steady because of input voltage drop for normal pwm control, oscillation frequency gets low, and becomes 100% duty finally. output voltage value is the dropped value of pch mosfets on voltage so that even low input voltage can keep output voltage. figure.27 current mode pwm control block diagram osc level shift driver logic rqs i l sw ith current comparator gm amp. set reset fb load sense v out v out figure.29 sllm tm switching timing chart curren t comparato r set reset sw v out pvcc gnd gnd gnd i l (ave) v out (ave) sense fb curren t comparato r set reset sw v out pvcc gnd gnd gnd 0a v out (ave) sense fb i l no switching i l fi gure. 28 pwm s w i tc hi ng t i m i ng c h art downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 12/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet ? soft-start function en terminal shifted to high activates a soft-starter to gradually establish the out put voltage with the current limited durin g startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ? shutdown function with en terminal shifted to low, the device turns to standby mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turned to off. circuit current during standby is 0 a (typ.). ? uvlo function detects whether the input voltage sufficient to secure the output voltage of this ic is supplied. and the hysteresis width of 50mv (typ.) is provided to prevent output chattering. figure.30 soft start, shut down, uvlo timing chart ? short-current protection circuit with time delay function turns off the output to protect the ic fr om breakdown when the incorporated current limiter is activated continuously for the fixed time(t latch ) or more. the output thus held tuned off may be recovered by restarting en or by re-unlocking uvlo. figure.31 soft start, shut down, uvlo timing chart hysteresis 50mv ts s ts s ts s uvlo en uvlo uvlo v cc en1,2 v out1 , v out2 soft start standby mode operating mode standby mode operating mode standby mode operating mode standby mode output short circuit threshold voltage i l limi t en timer latch en standby mode operating mode operating mode standby mode en1 en2 t2=t latch v out2 i l1 t1 www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 14/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet consideration on permissible dissipation and heat generation as this ic functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. in case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissi pation and/or heat generation must be carefully considered. for dissipation, only conduction losses due to dc resistance of inductor and on resistance of fet are considered. because the conduction losses are considered to play the leading role among other dissip ation mentioned above including gate charge/discharge dissipation and switching dissipation. example) if v cc =3.3v, v out1 =2.55v, v out2 =1.8v, r onh =850m ? , r onl =650m ? , i out =300ma d 1 =v out1 /v cc =2.55/3.3=0.77 d 2 =v out2 /v cc =1.8/3.3=0.55 r on1 =0.770.85+(1-0.77)0.65 =0.804 [ ? ] r on2 =0.550.85+(1-0.55)0.65 =0.760 [ ? ] p=0.3 2 0.804+0.3 2 0.760=0.141 [w] as r onh is greater than r onl in this ic, the dissipation increases as the on duty becomes greater. with the consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed. figure.32 thermal derating curve (vqfn016-v3030) p=i out 2 r on r on =d r onh +(1-d)r onl d on duty(=v out /v cc ) r onh highside mos fet impedance r onl lowside mos fet impedance i out output current ambient temperature:ta [ ] 0 25 50 75 100 125 150 0 2.0 1.77w 2.66w power dissipation:pd [w] 1.0 0.62w 0.27w 4 layers (copper foil area : 5505mm 2 ) (copper foil in each layers) j-a=47.0 /w 4 layers (1,4 layer copper foil area : 6.28mm 2 ) (2,3 layer copper foil area :5505mm 2 ) j-a=70.6 /w 1 layer (copper foil area : 6.28mm 2 ) j-a=201.6 /w ic only j-a=463.0 /w 105 3.0 downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 15/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet selection of components externally connected 1. selection of inductor (l) current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency. the inductor must be selected allowing sufficient ma rgin with which the peak current may not exceed its current rating. example) for BD91501MUV, if v cc =3.3v, v out =2.55v, f=1.65mhz, i l =0.60.3a=0.18a select the inductor of low resistance component (such as dcr and acr) to minimize dissipation in the inductor for better efficiency. 2. selection of output capacitor (c o ) ripple current value at output is greatly influenced by inductor value. refer to equation of (1),ripple cu rrent value is more decrease at switching frequency is higher and at inductor value is larger. [ a ] ??? ( 1 ) a ppropriate ripple current at output should be 60% more or less of the maximum output current i l =0.6 i out max. [a] ??? (2) l= (v cc -v out ) v out i l v cc f [ h ] ??? ( 3 ) ( i l : output ripple current f: switching frequency) output capacitor should be selected wi th the consideration on the stability region and the equivalent series resistance required to smooth ripple voltage. output ripple voltage is determined by the equation (4) v out = i l esr [v] ??? (4) ( i l : output ripple current esr: equivalent series resistance of output capacitor) rating of the capacitor should be determined allowing sufficient margin against output voltage. 22f to 100f ceramic capacitor is recommended. less esr allows reduction in output ripple voltage. figure.34 output capacitor i l v cc il l co vout figure.33 output ripple current i l v cc l co v out esr f vcc l vout vout) (vcc il ? ? ? ? ? output ripple current turns to be cramped at about 0.9a peak by considerin g the stable start-u p . 1.5h 4.7h l= =1.95h (3.3-2.55)2.55 0.183.31650k downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 16/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet 3. selection of input capacitor (cin) a low esr 22f/10v ceramic capacitor is recommended to reduce esr dissipation of input capacitor for better efficiency. 4. determination of rith, cith that works as a phase compensator as the current mode control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its esr. so, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described below to cancel a pole at the power amplifier. stable feedback loop may be achieved by canceling the pole fp (min.) produced by the output capacitor and the load resistance with cr zero correct ion by the error amplifier. i rms =i out v out ( v cc -v out ) v cc [ a ] ??? ( 5 ) when v cc =2 v out i rms = i out 2 example) for BD91501MUV, if v cc =3.3v, v out =2.55v, i outmax.= 0.3a, figure.36 open loop gain characteristics figure.37 error amp phase compensation characteristics figure.35 input capacitor v cc l co v out cin ) 0.126(a 3.3 2.55) 2.55(3.3 0.3 rms ? ? - input capacitor to select must be a low esr capacitor of the capacitance sufficient to cope with high ripple current to prevent high transient voltage. the ripple current irms is given by the equation (5): < worst case > i rms(max.) gain [db] phase [deg] a 00 -90 a 00 -90 fz(amp.) fp= 2 r o c o 1 fz (esr) = 2 e sr c o 1 pole at power amplifie r when the output current decreases, the load resistance ro increases and the pole frequency lowers. fp (min.) = 2 r omax. c o 1 [hz] with lighter load fp (max.) = 2 r omin. c o 1 [hz] with heavier load zero at power amplifie r fz (amp.) = 2 r ith c ith 1 fp(min.) fp(max.) fz(esr) i out min. i out max. gain [db] phase [deg] increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacitor esr reduces to half.) fz (amp.) = fp (min.) 2 r ith c ith 1 = 2 r omax. c o 1 downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 17/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet application example figure.38 application example l2 l1 v out1 avcc n.c. n.c. agnd c out 1 c in 1 c in 2 c out 2 r ith2 c ith2 pgnd1 pvcc1 pvcc2 pgnd2 ith1 fb1 en1 sw1 ith2 fb2 en2 sw2 v out2 r ith1 c ith1 vcc downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 18/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet evaluation top silk top layer bottom silk bottom layer figure.39 layout diagram layout the input ceramic capacitor cin closer to the pins pvcc and pgnd, and the output capacitor co closer to the pin pgnd. layout cith and rith between the pins ith and gnd as neat as possible with least necessary wiring. vqfn016v3030 (BD91501MUV) has thermal pad on the reverse of the package. the package thermal performance may be enhanced by bondin g the pad to gnd plane which take a large area of pcb. recommended components lists on above application symbol type value manufacturer part number l1,2 inductor 2.2h toko de2818c 1072as-2r2m c in1, c in2 ceramic capacitor 22f murata grm32eb11a226ke20 c out1, c out2 ceramic capacitor 22f murata grm31cb30j226ke18 c ith1 ceramic capacitor 330pf murata crm18 series r ith1 resistor 91k ? rohm mcr03 series c ith2 ceramic capacitor 330pf murata grm18 series r ith2 resistor 75k ? rohm mcr03 series the parts list presented above is an example of recommended parts. although the parts are sound, actual circuit characteristics should be checked on your application carefull y before use. be sure to allow sufficient margins to accommodate variations between external devices and this ic when employing the depicted circuit with other circuit constants modified. both static and transient characteristics should be considered in establishing these margins. when switching noise is substantial and may impact the system, a low pass filter should be inserted between the vcc and p vcc pins, and a schottky barrier diode or snubber established between the sw and pgnd pins. downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 19/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet i/o equivalence circuit figure.40 i/o equivalence circuit operational notes 1. absolute maximum ratings while utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. if broken, short-mode or open-mode may not be identified. so if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. electrical potential at gnd gnd must be designed to have the lowest electrical potential in any operating conditions. 3. short-circuiting between terminals, and mismounting when mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. failure to do so may result in ic breakdown. short-circuiting due to foreign matters entered between output terminals, or between output and power supply or gnd may also cause breakdown. 4. thermal shutdown protection circuit thermal shutdown protection circuit is the circuit designed to isolate the ic from thermal runaway, and not intended to protect and guarantee the ic. so, the ic the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally intended. 5. inspection with the ic set to a pc board if a capacitor must be connected to the pin of lower impedance during inspection with the ic set to a pc board, the capacitor must be discharged after each process to avoid stress to the ic. for electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. when connecting to jigs in the inspection process, be sure to turn off the power supply before it is connected and removed. en1,en2 ? en1,en2 pin ? sw1,sw2 pin pv cc sw1/sw2 pv cc pv cc ith1,ith2 ? ith1,ith2 pin a v cc ? fb1,fb2 pin fb1/fb2 88k 10k 1120k 300k/250k 850k/500k 400k/400k 43.75 10 k downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 20/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet 6. input to ic terminals this is a monolithic ic with p + isolation between p-substrate and each element as illustrated below. this p-layer and the n-layer of each element form a p-n junction, and various parasitic element are formed. if a resistor is joined to a transist or terminal as shown in figure 41. p-n junction works as a parasitic diode if the following relationship is satisfied; gnd>terminal a (at resistor side), or gnd>terminal b (at transistor side); and if gnd>terminal b (at npn transistor side), a parasitic npn transistor is activated by n-layer of other element adjacent to the above-mentioned parasitic diode. the structure of the ic inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. it is theref ore requested to take care not to use the device in such manner that the voltage lower than gnd (at p-substrate) may be applied to the input terminal, which may result in activation of parasitic elements. figure.41 simplified structure of monoclinic ic 7. ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiri ng pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay att ention not to cause fluctuations in the gnd wiring pattern of external parts as well. 8 . selection of inductor it is recommended to use an inductor with a series resistance element (dcr) 0.1 or less. especially, note that use of a high dcr inductor will cause an inductor loss, resulting in decreased output voltage. should this condition continue for a specified period (soft start time + timer latch time), output short circuit protection will be activated and output will be lat ched off. when using an inductor over 0.1 , be careful to ensure adequate margins for variation between external devices and this ic, including transient as well as static characteristics. furthermore, in any case, it is recommended to start up the output with en after supply voltage is within operation range. ordering information packaging and forming specification b d 9 1 5 0 1 m u v part number e2 : embossed taping and reel muv : vqfn016v3030 D e 2 package resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element downloaded from: http:/// www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 21/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet physical dimension tape and reel information marking diagram (top view) vqfn016v3030 5 0 1 product name lot numbe r 1pin mark d 9 1 ? order quantity needs to be multiple of the minimum quantity. www.rohm.com tsz02201-0j3j0a900260-1-2 ?2012 rohm co., ltd. all rights reserved. 22/22 31.aug.2012 rev.001 tsz22111 ? 15 ? 001 BD91501MUV datasheet revision history date revision changes 31.aug.2012 001 new release downloaded from: http:/// datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
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